Project Z1

MEMS Magnetoelectric Sensor Fabrication

Project Z1 will concentrate on the development of a cross-institutional (Christian-Albrechts-Universität zu Kiel (CAU) and Fraunhofer Institute for Silicon Technology (ISIT)) process technology for MEMS ME sensors, the fabrication of a sufficiently large number of ME sensors based on the newest findings for research in part B projects, the provision of partly processed wafers for research in part A projects, and the extension of the cross-institutional process technology to promising new materials and sensor concepts. Technology development includes vacuum packaging of MEMS ME sensors and hybrid assembling of vector field sensors for the envisaged biomagnetic applications.

Role within the Collaborative Research Centre

Research Centre Project Z1 plays a central role within the framework of the proposed Collaborative Research Centre as it bridges the gap between part A projects on ME sensor research and projects of part B, where ME sensors are evaluated in advanced medical applications. Project Z1 will contribute to the focus group F2 “Sensor concepts” on issues of fabrication and sensor technology. Collaborations with the following projects are planned:

A1:	Providing partially-processed wafers for studies with magnetic multilayers. Integration of new magnetic multilayers. Integration of amorphous FeGaB.
A2:	Providing partially processed wafers for studies on electret deposition on silicon wafers.
A3:	Providing partially processed wafers for studies on resonant sensors.
A4:	Fabrication of ΔE-effect sensors.
A5:	Providing partially-processed wafers for studies on the integration of piezotronic amplifiers in base-line ME sensors.
A6:	Support in material development of AlScN with regard to an increase in the piezoelectric coefficient by studies of the texture and polarity of the piezoelectric domains of AlScN with respect to the Sc-content.
A7:	Providing partially-processed wafers for studies on electrically modulated magnetoelectric sensors.
B1:	Providing ME sensors for studies on sensor arrays and 3D sensors.
B2, B5, B7:	Providing a sufficient number of ME sensors for studies on digital signal processing, clinical evaluation in cardiology and encephalography, and magnetic particle imaging. Receiving feedback on sensor performance..
B6:	Providing ME sensors for the setup of ME sensor arrays for studies on nerve pathology.
Z2:	Electronics assembly of ME sensors.

By providing a technology platform, the fabrication of an adequate number of MEMS ME sensors with sufficient similar sensor properties will be achieved. This is of major importance for the construction and investigation of signal processing units and sensor arrays in part B. Furthermore, project Z1 can provide partially processed wafers based on the technology platform to the A projects for their use in sensor research. This enables concentration on the particular research objectives in A projects and eases later transfer of new findings into the technology platform.

The platform definition will be elaborated in close cooperation with part A and part B projects. Thereby requirements derived from ME sensor research and signal processing are incorporated. This is of special importance for the integration of new concepts and materials into the existing process flows. Whereas basic electric characterization of fabricated sensor elements is conducted in project Z1 using wafer probers, characterization of magnetostrictive and piezoelectric functional components is done in the projects on sensor technology. A comparison of ME sensors either fabricated by MEMS in project Z1 or on chip-scale in the corresponding A project will identify deviations which might arise from the transfer into the platform. Likewise, data on sensor performance from part B projects will serve as feedback to the following redefinition run for next generation sensors.

Project-related Publications

F. Niekiel, J. Su, M.T. Bodduluri, T. Lisec, L. Blohm, I. Pieper, B. Wagner, F. Lofink, Highly sensitive MEMS magnetic field sensors with integrated powder-based permanent magnets. Sens. Actuators A 297, 111560 (2019). https://doi.org/10.1016/j.sna.2019.111560

B. Spetzler, C. Kirchhof, J. Reermann, P. Durdaut, M. Höft, G. Schmidt, E. Quandt, F. Faupel, Influence of the quality factor on the signal to noise ratio of magnetoelectric sensors based on the delta-E effect. Appl. Phys. Lett. 114, 183504 (2019). https://doi.org/10.1063/1.5096001

S. B. Hrkac, C. T. Koops, M. Abes, C. Krywka, M. Müller, M. Burghammer, M. Sztucki, T. Dane, Kaps, Y. K. Mishra,R. Adelung, J. Schmalz, M. Gerken, E. Lage, C. Kirchhof, E. Quandt, O. M. Magnussen, B. M. Murphy, Tunable Strain in Magnetoelectric ZnO Microrod Composite Interfaces. ACS Appl. Mater. Interfaces, 9 (30), pp 25571–25577 (2017). DOI: 10.1021/acsami.6b15598

S. Fichtner, N. Wolff, G. Krishnamurthy, A. Petraru, S. Bohse, F. Lofink, S. Chemnitz, H. Kohlstedt, L. Kienle, B. Wagner, Identifying and overcoming the interface originating c-axis instability in highly Sc enhanced AlN for piezoelectric micro-electromechanical systems. Journal of Applied Physics 122, 035301 (2017). http://dx.doi.org/10.1063/1.4993908

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Project Z1

MEMS Magnetoelectric Sensor Fabrication

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Role within the Collaborative Research Centre

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